CMP machine dresser and method for detecting the dislodgement of diamonds from the same

ABSTRACT

A CMP machine dresser. The dresser includes a substrate, a first conductive layer and a second conductive layer respectively disposed and isolated in the substrate, a plurality of diamonds mounted in the first conductive layer and the second conductive layer, and a bonding layer disposed on the substrate for attaching the diamonds. The first conductive layer and the second conductive layer detect the conductive materials penetrating the original position of the diamonds when any of the diamonds dislodges, so as to determine the diamonds dislodgement.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a dressing apparatus forconditioning and regenerating a chemical mechanical polishing (referredto as CMP hereafter) pad, and more particularly to a CMP machine dresserand method for detecting dislodgement of diamonds from the same.

[0003] 2. Background

[0004] As densities of Integrated Circuits increase, the globalplanarization of the intermediate insulating layer has become important.CMP in particular has received special attention as a planarizationmethod. Highly integrated semiconductor devices are manufactured bydepositing conducting materials between insulating materials alternatelyto form patterns. The surface must be flat in order to apply the patternlayer.

[0005] As the semiconductor devices get more integrated, theminiaturization of features and multilevel interconnections are needed.Global planarization is one of the most important prerequisites toachieve this. As the structure of microprocessors and DRAMs becomesmultileveled, problems may occur if the layers upon which the film isdeposited are not flat. In the photolithography process in particular,if the process begins on an unflattened layer, incident light willreflect diffusely, which will cause an imprecise photo resist pattern.Planarization of the surface must take place by polishing theunnecessarily deposited areas.

[0006] Polishing pads must be cleaned after use due to residue. FIG. 1shows a perspective view of a dressing apparatus, illustrating how it isintegrated into a CMP device for wafer processes. As shown in FIG. 1,the dressing apparatus 10 includes a sleeve bearing mechanism 12, acarrier plate 14, and a plurality of dressers 16. The CMP deviceincludes a rotating platform 20. A polish pad 22 is disposed on therotating platform 20. Furthermore, the polishing pad 22 comprises alayer of microporous polyurethane material having an upward workingsurface 24. A wafer carrier 26 is used to carry a wafer 28 to bepolished by the working surface 24 of the polishing pad 22 and apolishing slurry 30. The polishing slurry 30 is delivered onto theworking surface 24 via a nozzle 32, whereby the porous polishing pad 22is permeated with the polishing slurry 30.

[0007]FIG. 2 is a cross-section of the dresser 16. The dresser 16includes a substrate 50, a plurality of diamonds 52, and a bonding layer54, wherein the bonding layer 54 is used for mounting the diamonds 52onto the substrate 50. In practice, however, some of the diamonds 52fall off and attach to the working surface 24 of the polishing pad 22 incleaning, thus causing wafers be damaged in subsequent polishingprocesses.

SUMMARY OF THE INVENTION

[0008] The object of the present invention is to solve theabove-mentioned problems and to provide a CMP machine dresser and methodfor detecting dislodgement of diamonds from the same. Immediatedetection can prevent wafer damage for the subsequent polishing process.

[0009] The present invention discloses a CMP machine dresser, comprisinga substrate, a first conductive layer and a second conductive layerrespectively disposed and isolated in the substrate, a plurality ofdiamonds mounted in the first conductive layer and the second conductivelayer, and a bonding layer disposed on the substrate for attaching thediamonds. The first conductive layer and the second conductive layerdetect the conductive materials penetrating into the original positionof the diamonds when any of the diamonds dislodges.

[0010] Furthermore, the invention proposes a method for detectingdiamonds dislodging from the CMP machine dresser comprising the steps ofproviding a substrate, in which a first conductive layer and a secondconductive layer are respectively disposed and isolated, and mounting aplurality of diamonds in the first conductive layer and the secondconductive layer, and disposing a bonding layer for attaching thediamonds to the substrate; and detecting whether or not the shortcircuit of the first conductive layer to the second conductive layeroccurs, so as to determine whether any of the diamonds dislodges;wherein, the short circuit of the first conductive layer to the secondconductive layer occurs when any of the diamonds dislodges andconductive materials penetrate the original position of the diamonds.

BRIEF DESCRIPION OF THE DRAWINGS

[0011] The following detailed description, given by way of example andnot intended to limit the invention solely to the embodiments describedherein, will best be understood in conjunction with the accompanyingdrawings, in which:

[0012]FIG. 1 shows a perspective view of a dressing apparatus;

[0013]FIG. 2 (Prior Art) is a cross-section of a conventional dresser;

[0014]FIG. 3 is a cross-section of the dresser in the preferredembodiment; and

[0015]FIG. 4 is a schematic drawing illustrating when some of thediamonds of the dresser fall off and the short circuit occurs in thepreferred embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0016]FIG. 3 is a cross-section of the dresser in the preferredembodiment. As shown in FIG. 3, the dresser 100 includes a substrate102, a first conductive layer 104 and a second conductive layer 106respectively disposed and isolated in the substrate. The firstconductive layer 104 and the second conductive layer 106 can becomprised of, for example, any conductive material, such as metals oralloys.

[0017] A plurality of diamonds 108 are mounted in the first conductivelayer 104 and the second conductive layer 106. A bonding layer 110 isdisposed on the substrate 102 for attaching the diamonds 108.

[0018] The dresser 100 in the preferred embodiment can further use adetecting circuit 120, connected to the first conductive layer 104 andthe second conductive layer 106. The detecting circuit 120 can feed backto the chemical mechanical polishing machine when the short circuit ofthe first conductive layer 104 to the second conductive layer 106occurs. The detecting circuit 120 can be comprised of, for example, alow voltage and current circuit.

[0019]FIG. 4 is a schematic drawing illustrating a number of diamondsdislodging from the dresser and the subsequent short circuit. A void 122is formed when one of the diamonds 108 dislodges. If conductivematerials 124 penetrate the void 122, the short circuit of the firstconductive layer 104 to the second conductive layer 106 occurs, so as todetect any of the diamonds dislodging. Meanwhile, the detecting circuit120 feeds back to the chemical mechanical polishing machine and ceasesoperation. The conductive materials 124 can be comprised of, forexample, a polishing slurry or water.

[0020] A method for detecting diamonds dislodging from the CMP machinedresser according to the preferred embodiment of the present inventionwill now be described. First, a substrate is provided in which a firstconductive layer and a second conductive layer are respectively disposedand isolated, and a plurality of diamonds are mounted in the firstconductive layer and the second conductive layer, and a bonding layer isdisposed for attaching the diamonds to the substrate. Detection forshort circuits between the first conductive layer and the secondconductive layer is carried out, so as to determine whether any of thediamonds dislodges. Thus, when diamonds dislodge and conductivematerials penetrate the original position of the diamonds, a shortcircuit between the first conductive layer and the second conductivelayer occurs. The first conductive layer and the second conductive layercan be comprised of, for example, any conductive materials, such asmetals or alloys. The conductive materials can be comprised of, forexample, a polishing slurry or water.

[0021] The method for detecting diamonds dislodging from the CMP machinedresser according to the preferred embodiment of the present inventionfurther comprises a step of using a detecting circuit connected to thefirst conductive layer and the second conductive layer, then feedingback to the chemical mechanical polishing machine when the short circuitof the first conductive layer to the second conductive layer occurs.

[0022] Any of the diamonds dislodging is detected immediately, therebypreventing wafers from damage in the subsequent polishing process.

[0023] While the invention has been described with reference to variousillustrative embodiments, the description is not intended to beconstrued in a limiting sense. Various modifications of the illustrativeembodiments, as well as other embodiments of the invention, will beapparent to those persons skilled in the art upon reference to thisdescription. It is therefore contemplated that the appended claims willcover any such modifications or embodiments as may fall within the scopeof the invention defined by the following claims and their equivalents.

1-6 (canceled)
 7. A method for detecting diamonds dislodging from theCMP machine dresser comprising the steps of: providing a substrate, inwhich a first conductive layer and a second conductive layer arerespectively disposed and isolated, and mounting a plurality of diamondsin the first conductive layer and the second conductive layer, anddisposing a bonding layer for attaching the diamonds to the substrate;and detecting whether or not the short circuit of the first conductivelayer to the second conductive layer occurs, so as to determine whetherany of the diamonds dislodges; wherein, the short circuit of the firstconductive layer to the second conductive layer occurs when any of thediamonds dislodges and conductive materials penetrate the originalposition of the diamonds.
 8. The method as recited in claim 7, furthercomprising a step of using a detecting circuit connected to the firstconductive layer and the second conductive layer, then feeding back tothe chemical mechanical polishing machine when the short circuit of thefirst conductive layer to the second conductive layer occurs.
 9. Thedresser as recited in claim 7, wherein the conductive layer comprisesmetals or alloys.
 10. The method as recited in claim 7, wherein theconductive materials comprise a polishing slurry.
 11. The method asrecited in claim 7, wherein the conductive materials comprise water. 12.The method as recited in claim 7, wherein the detecting circuitcomprises a low voltage and current circuit.